iwlpc - international wafer level packaging conference

smta and chip scale review are pleased to announce the 17th an**al international wafer-level packaging conference and ******op exhibition. iwlpc brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3d, tsv, and mems device packaging and ma**facturing. the iwlpc technical committee would like to invite you to submit an abstract for this progr**. abstract deadline extended: may 15, 2020